Sinic‑TEK S8080L
Sinic‑TEK S8080L SPI is an inline automatic 3D solder paste inspection machine. Using laser‑based 3D measurement technology, it inspects solder paste thickness, volume, area, bridging and voids after …
View MorePemtron 7700HD is a high‑definition True‑3D inline solder paste inspection machine from South Korea. Adopting blue‑light moiré interferometry technology, it delivers stable performance at competitive price, widely used in automotive electronics, industrial control and communication industries.
Core Specifications
PCB Size: Single‑lane max. 510×510mm, Dual‑lane 510×320mm, Thickness 0.4–5mm
Inspection Accuracy: XY 8μm, Z‑axis 0.6μm, compatible with 01005 ultra‑fine pads & 0.3mm fine pitch
3D Technology: Multi‑view blue‑light True‑3D moiré imaging with excellent shadow suppression
Inspection Items: Solder paste thickness, volume, area, bridging, insufficient/excess paste, voids and slump
Machine Dimension: W1150×D1440×H1670mm, Weight approx. 1020kg
Power & Air: AC220V, Air pressure 0.5MPa
Key Features
High‑definition True‑3D imaging with low false‑alarm rate
Cost‑effective Korean‑imported alternative to Koh Young
AI‑powered algorithm for fast programming and stable fine‑pitch inspection
Traceable data complying with IATF16949 & IPC‑610 standards
Compact rigid structure for reliable 24/7 mass production