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Koh Young 8030‑2

Koh Young 8030‑2 is a premium True‑3D inline solder paste inspection (SPI) machine from South Korea. Based on patented moiré interferometry True‑3D technology, it is widely used in automotive electronics, medical devices, servers and new‑energy industries for high‑precision quantitative solder paste inspection.

Core Specifications

PCB Size: Single‑lane max. 510×510mm, Dual‑lane 510×320mm, Thickness 0.4–5mm

Inspection Accuracy: XY 7μm, Z‑axis 0.5μm, compatible with 01005 ultra‑fine pads

3D Technology: Multi‑view moiré‑fringe True‑3D imaging, shadow‑free inspection

Inspection Items: Solder paste thickness, volume, area, offset, bridging, insufficient/excess paste, voids and slump

Machine Dimension: W1160×D1450×H1680mm, Weight approx. 1050kg

Power & Air: AC220V, Air pressure 0.5MPa

Key Features

Shadow‑free True‑3D inspection with multi‑angle projection

Ultra‑high precision quantitative measurement complying with IPC‑610 & IATF16949 standards

AI‑powered algorithm ensures stable inspection for fine‑pitch pads with low false‑alarm rate

Closed‑loop quality control via real‑time SPC data analysis

Industry‑leading stability for 24/7 mass production

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