MPM Momentum+

MPM Momentum+ is a top‑tier flagship fully automatic solder paste printer manufactured by MPM (Speedline Group, USA). Featuring ultra‑high precision, stability and intelligent closed‑loop printing, it is widely adopted in automotive electronics, medical devices, servers and high‑end semiconductor production lines worldwide.

Core Specifications

Max PCB Size: 610×510mm, Board Thickness 0.3–6.5mm

Alignment Accuracy: ±10μm, dual high‑resolution camera alignment with warpage compensation

Printing Repeatability: ±5μm

Squeegee System: Closed‑loop servo pressure control for ultra‑fine pitch printing

Stencil Cleaning: 4‑stage intelligent cleaning (dry/wet/vacuum/solvent atomization)

Printing Mode: Single/dual‑squeegee, high‑speed bidirectional printing

Power & Air: AC220V, Air pressure 0.5MPa

Key Features

Industry‑leading printing repeatability for 01005 and ultra‑fine‑pitch components

Intelligent closed‑loop system linked with SPI for automatic parameter adjustment

Large‑size PCB compatibility and high throughput for mass production

Military‑grade robust structure with ultra‑high long‑term uptime

Full production data traceability complying with IATF16949 & ISO13485 standardsMPM Momentum+ is a top‑tier flagship fully automatic solder paste printer manufactured by MPM (Speedline Group, USA). Featuring ultra‑high precision, stability and intelligent closed‑loop printing, it is widely adopted in automotive electronics, medical devices, servers and high‑end semiconductor production lines worldwide.

Core Specifications

Max PCB Size: 610×510mm, Board Thickness 0.3–6.5mm

Alignment Accuracy: ±10μm, dual high‑resolution camera alignment with warpage compensation

Printing Repeatability: ±5μm

Squeegee System: Closed‑loop servo pressure control for ultra‑fine pitch printing

Stencil Cleaning: 4‑stage intelligent cleaning (dry/wet/vacuum/solvent atomization)

Printing Mode: Single/dual‑squeegee, high‑speed bidirectional printing

Power & Air: AC220V, Air pressure 0.5MPa

Key Features

Industry‑leading printing repeatability for 01005 and ultra‑fine‑pitch components

Intelligent closed‑loop system linked with SPI for automatic parameter adjustment

Large‑size PCB compatibility and high throughput for mass production

Military‑grade robust structure with ultra‑high long‑term uptime

Full production data traceability complying with IATF16949 & ISO13485 standards