TRI TR7700 SII (Plus)
TRI TR7700 SII (Plus) is the world’s first hybrid‑mode inline automatic 2D AOI system, featuring switchable dynamic continuous imaging and stop‑and‑go modes. Balancing high throughput and precision in…
View MoreKohYoung ZENITH series is a world‑leading True 3D inline automatic AOI system from South Korea. Adopting patented moiré interferometry True 3D measurement technology, it eliminates shadow interference and delivers quantitative inspection with ultra‑low false‑alarm rate, widely used in automotive electronics, medical devices, servers, 5G and semiconductor industries.
Core Specifications (Mainstream L‑size Dual‑lane Model)
PCB Size: Single‑lane max. 510×510mm; Dual‑lane 510×320mm, Thickness 0.4–5mm, Max weight 4kg
Inspection Accuracy: ±3μm, compatible with 01005 ultra‑small chips, 0.3pitch fine‑pitch ICs and BGA coplanarity inspection
Inspection Height: Up to 25mm, supports tall‑component inspection with zero shadow interference
Vision System: Multi‑projection moiré interferometry True 3D imaging + AI algorithm, 40% lower false‑alarm rate than traditional AOI
Inspection Speed: 4–6 FOV/s, optimized for high‑speed mass‑production lines
Power & Air: AC220V, Air pressure 0.5MPa
Key Features
True 3D Quantitative Measurement: The only solution complying strictly with IPC‑610 standards, providing objective solder‑joint volume/height data
Powerful Anti‑shadow Performance: Multi‑angle projection solves shadow issues caused by tall components, ideal for high‑density server boards
AI‑powered Auto‑programming: One‑click intelligent programming for odd‑form parts, through‑hole and selective soldering inspection
Top‑tier Industrial Stability: High‑rigidity mechanical structure, vibration‑resistant for 24/7 continuous production
Full Defect Coverage: Detects missing components, offset, reversed polarity, tombstone, bridging, cold solder, BGA coplanarity and lifted pins