Omron VT-X750

True 3D CT volumetric imaging eliminates 2D inspection blind spots
Equipped with proprietary 3D-CT reconstruction algorithm, the system slices hidden solder joints into hundreds of virtual cross-sections. It effectively avoids overlapping component shadow interference, precisely detecting challenging defects including head-in-pillow, voids, insufficient solder, bridging and open circuits. It delivers reliable measurement for BGA, PoP, QFN, press-fit connectors, through-hole devices and bottom-terminated semiconductors, ideal for high-density double-sided PCBs.
Flexible high-resolution options and outstanding imaging performance
Pixel resolution ranges from 3 μm to 30 μm for free selection according to inspection targets. Adopting micro-focus sealed X-ray tube and flat-panel detector, it achieves stable, high-contrast imaging for tiny bumps and miniaturized packages. Quantitative 3D solder joint analysis enables objective OK/NG judgment compliant with IPC standards, greatly reducing escape risk in mass production.
Industry-leading speed supports full-board inline 100% inspection
Optimized continuous motion control across multiple FOVs shortens cycle time significantly compared with older generations. The upgraded inspection logic covers diverse component types, making full inline 3D CT inspection feasible to match high-speed SMT lines. It balances high throughput and detection accuracy for automotive electronics, 5G modules and power device manufacturing.
AI-powered workflow cuts programming time and lowers operation cost
Built-in AI assists automatic component library creation, inspection parameter tuning and CAD-based offline programming. Operators can complete program editing without halting production. The intuitive graphical interface reduces reliance on experienced technicians and shortens new product changeover lead time.
Smart factory compatibility and reliable safety design
It supports SECS/GEM communication and seamlessly connects with Omron Q-upNavi to unify SPI, AOI and AXI data for root-cause process analysis. The machine maintains ultra-low radiation leakage below safety thresholds. Worldwide after-sales service network ensures stable uptime, helping manufacturers achieve zero-defect production and improve long-term equipment ROI.