Bruce: +86 138 2336 0271
Kitty: +86 199 0157 8421

bruce@smtfdh.com
tanqian@smtfdh.com

Home / Products / X-ray

Nordson DAGE XD7600 NT

Nordson DAGE XD7600 NT is a flagship micro‑focus X‑ray non‑destructive inspection system from UK. Designed for high‑end SMT production, it inspects BGA, CSP, flip‑chip solder joints, voids, cold joints and internal defects. It is widely used in automotive electronics, medical devices, servers and semiconductor industries, with optional µCT for 3D volumetric measurement.

Core Specifications

X‑ray Tube: Patented NT500 maintenance‑free sealed transmission tube, 30‑160kV, max 10W

Resolution: 0.5μm, max system magnification 23,400×

Viewing Angle: 0‑70° oblique + 360° rotation, zero blind spot

Max PCB Size: 508×444mm, max sample weight 5kg

Imaging System: 2‑megapixel high‑speed CMOS detector, 25fps real‑time imaging

Options: µCT 3D tomography, X‑Plane non‑destructive layer inspection, solder joint volume measurement

Inspection Items: BGA voids, bridging, ball offset, open circuits, internal PCB defects

Key Features

Ultra‑high precision non‑destructive inspection complying with IATF16949 automotive standards

70° wide oblique‑angle viewing for full‑area defect detection

Maintenance‑free sealed X‑ray tube with long service life for 24/7 mass production

µCT 3D tomography enables solder joint modeling and quantitative analysis

Fully compatible with high‑end SPI, AOI and reflow ovens for complete SMT production line

Get a Quote Email

You May Also Like